Power

输入电源

· Furnace input AC220V.  50/60 HZ

输入电压 220V   50/60 HZ

Working Temperature

工作温度

· Max. Temperature: 1700 °C  (< 1 hr)

   最高温度：1700℃(< 1 hr)

· Continuous working temperature: 1650 °C

   持续工作温度：1650℃

· Heating Rate: below 1400℃，≤10°C /min；1400-1650℃，≤5°C /min

   升温速率：1400℃以下，≤10℃/min；1400到1650℃，≤5℃/min

Heating Zone

加热区

· Heating Zone Length:          11.81" ( 300mm)

          加热区长度：11.81" ( 300mm)

· Constant  Zone Length:          5.9" (150mm)

恒温区长度：5.9" (150mm)

Temperature Controller

控温方式

· PID automatic control and auto-tune function.

   模糊PID控制和自整定调节

· 30 programmable segments for precise thermal processing.

   智能化30段可编程控制

· Built-in protection for the over-heated and broken thermocouple. 

超温和断偶报警功能

· Temperature Accuracy: +/- 1 °C.

   控温精度：+/- 1 °C

· S type thermocouple.

   S型热电偶

Heating Elements

加热元件

·  MoSi₂ rod

   硅钼棒

Processing Tube

炉管

· Ceramic tube:  60/80/100OD*1000Lmm

          刚玉管：60/80/100（外径）*1000（长）mm     

· Two fibrous ceramic tube blocks are included for blocking heat radiation generated from tube center. (Ceramic blocks must be fully inserted into the furnace chamber before heating).

   两个氧化铝管堵阻挡管中心产生的热辐射（氧化铝管堵必须在加热前塞进炉膛）

Vacuum Flange

真空法兰  

· Choose clamp flange or folding flanges depends on diameter of tube

   根据管径不同，法兰分为卡箍和折页两种密封方式

Vacuum Pressure

真空压力

· 10^-1pa can be achieved by mechanical pump

   机械泵可达10^-1pa

· 10^-3pa can be reached by molecular pump

   分子泵可达10^-3pa

Dimensions

尺寸

Tube body 610*440*720mm（L*W*H without tube & flange）

炉体： 610*440*720mm（不含炉管和法兰）

Net weight设备净重

130kg

Warranty

质保

One year limited warranty with lifetime support  (Consumable parts such as processing tubes, and O-rings are not covered by the warranty, please  order replacements at related products below.)

一年质保终身支持（消耗品如炉管，O型圈不在质保范围内，可点击下方订购更换件）

Compliance

认证

· CE Certified

   CE认证           

Application Note

应用

l Widely used for high tem. Experiment environment, for example, vacuum or atmosphere sintering, substrate coating

   广泛用于真空或气氛烧结、基片镀膜等要求加热温度较高的实验环境

l Widely used for new material field,such as semiconductor,nanometer material,carbon fiber,graphene

   广泛应用在半导体、纳米材料、碳纤维、石墨烯等新材料、新工艺领域